广东深圳市乐泰E-1216 乐泰UF3808 汉高乐泰UF3808胶水供应1支起订

优势 供应乐泰UF380  ECCOBOND UF3808  乐泰UF3810  乐泰UF3820原装正品一级授权代理 

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Cure Heat cure

Application Underfill

Typical Package

Application

Chip stack packages and BGA

LOCTITE ECCOBOND UF 3808 capillary underfill is designed

to cure quickly at low temperatures to minimize stress to other

components. When cured, this material provides excellent

mechanical properties to protect solder joints during thermal

cycling.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity @ 20 s-1 , Cone and Plate, mPa?s (cP) 360

Specific Gravity, 1.16

Pot life @ 25°C, 25% viscosity increase, days 3

Shelf Life @ -20°C, days 365

Flash Point - See SDS